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Fineness Detection of Precious Metal Slurry in Microelectronic Technology with Fineness Meter

Abstract: 本文介绍了一种用于检测微电子技术中贵金属浆料细度的刮板测定方法。该方法通过在细度计上刮动浆料,利用细度计上出现的纵向条纹位置来判断颗粒大小。细度计的测量范围为0 μm~25 μm,精度为1 μm。测试过程中,首先在规定的环境条件下清洁设备并准备试样。将浆料均匀放置于细度计沟槽中,然后用刮板刮动浆料,观察沟槽中条纹的出现位置以测量颗粒大小。重复测量多个试样后,取其平均值作为最终结果。如果读数中存在异常值,则重新测试双倍试样以确保准确性。检测报告应包括浆料的详细信息和测试结果。该方法能够有效确保贵金属浆料的细度符合要求,从而保障微电子器件的性能和稳定性。

Precious metal slurries are increasingly used in microelectronics technology, and the detection of their fineness is particularly important. Fineness directly affects the performance and stability of precious metal slurries in microelectronic devices. This article introduces a scraper measurement method for fineness detection of precious metal slurries in microelectronics technology.

Method principle

The principle of this method is to place the slurry on the Fineness Meter and then scrape it from top to bottom with a scraper. The size of the particles was determined by visual inspection based on the position in the trough where the longitudinal stripes appeared.

Equipment and Instruments

Scraper Fineness Meter: The measurement range is 0 μm~25 μm, the accuracy is 1 μm, and the calibration period is half a year.

Sizing Knife: Stainless steel knife with a thickness of 1 mm and a wooden handle.

Scraper: Used to scrape the slurry from the Fineness Meter.

Using a Fineness Meter to detect the fineness of precious metal slurries in microelectronics technology Figure 1

Sample preparation

Stir the precious metal slurry submitted for inspection evenly to ensure that the sample is well representative.

Determination steps

Preparation environment: Test in an environment with temperature 15°C~35°C, relative humidity 45%75%, and atmospheric pressure 86 kPa106 kPa.

Cleaning preparation: Clean the scraper fineness gauge with the corresponding chemical pure grade cleaning agent.

Place the sample: Place the sample evenly in the deepest groove of the Fineness Meter.

Scrape the slurry: Hold the scraper with both hands at the deepest groove of the Fineness Meter, make the scraper perpendicular to the surface of the Fineness Meter, and scrape the sample across the surface of the Fineness Meter from the deepest groove at a uniform speed. The material fills the groove, leaving no excess sample on the flat plate. The entire operation process is completed within 3 seconds.

Observation record: Within 3 seconds, hold the scraped Fineness Meter horizontally and tilt it so that the line of sight is at an angle of 20°~30° with the groove plane. Observe against the light to find out whether two longitudinal lines begin to appear in the groove. The location of the fringe display and the particle reading are recorded.

Repeated measurement: Use the same operating method to measure no less than 5 samples.

Expression of measurement results

Take the average reading of no less than 5 measurement samples as the measurement result.

If the difference between one reading of no less than 5 test specimens and its average value is greater than 3 times its standard deviation, double specimens should be taken for testing again, and the test steps should be carried out in accordance with the aforementioned regulations.

If the above conditions do not appear in the test readings of the double sample, the abnormal readings can be discarded and the arithmetic mean of all remaining readings can be taken as the test result.

Numerical rounding is performed in accordance with the provisions of GB/T8170, and the test results are taken to two significant figures.

Test Report

After completing the test, a test report should be formed, which includes the following main contents:

  • Slurry name, brand and specifications;

  • Sample No;

  • Slurry batch number;

  • Test results and seal of the testing department;

  • This standard number;

  • Tester and test date.


Through the scraper measurement method, the fineness of precious metal slurries used in microelectronics technology can be effectively tested to ensure that its quality meets relevant requirements, thereby ensuring the performance and reliability of microelectronic devices.


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