Effect of scratch agent on performance of polycarbonate/whisker silicon system

Polycarbonate is a kind of plastic with good transparency. It is widely used in electronic appliances, machinery manufacturing, computers, aerospace and other fields. However, the surface scratch resistance of polycarbonate materials is poor, which greatly reduces the product's Appearance quality, therefore, in order to make polycarbonate have higher scratch resistance and meet more high-end product applications. Sun Xiaowen, Liu Bin, and Qiu Yi from South CHINA University of Technology conducted experimental research. The "Influence of Anti-Scratch Agents on the Performance of Polycarbonate/Whisker Silicon System" introduced the entire experimental process. The mass fraction of anti-scratch agents was The polycarbonate/whisker silicon system modified with 5% whisker silicon was modified for scratch resistance, and the scratch resistance was measured by pencil Hardness Tester, Vicat instrument, electronic multifunctional testing machine and high-pressure rheometer. Various properties of polycarbonate/whisker silicon system modified by wounding agent.

Experimental results:

(1) With the increase of the anti-scratch agent content, the tensile strength, flexural strength, melt flow rate and scratch resistance of the polycarbonate/5% whisker silicon system improved, and the notched impact strength and elongation at break The non-Newtonianity of the melt is weakened as the elongation decreases; when the anti-scratch agent content is 2%, the scratch resistance of the modified system is better, and the pencil hardness reaches 3H;

(2) The good modification formula for this research is: polycarbonate/5% whisker silicon/1.2% anti-scratch agent. At this time, the heat distortion temperature of the modified system is 136.8°C, the initial decomposition temperature is 509.4  °C , the degradation temperature is 533.3 °C , the tensile strength is 72.61MPa, the elongation at break is 6.07%, the bending strength is 84.99MPa, and the impact strength It is 5.13KJ/m ² , the melt flow rate is 42.36g/10min, and the pencil hardness is 2H.