Spin-on cleaning and specific cleaning steps

Abstract: 本文探讨了旋涂在基板清洁中的应用及其具体步骤。尽管旋涂清洁通常效果不如声波浴，并且速度较慢，但在某些情况下（如HMDS和其他表面改性处理），旋涂清洁和洗涤步骤仍然非常有效。此外，旋涂可用于去除某些添加剂。旋转洗涤过程中，研究人员使用中等体积的溶剂（如50 µl），并进行多次洗涤。然而，需要注意的是，未去除多余溶剂可能导致大量蒸汽，进而影响后续薄膜的干燥过程。

Spin coating can also be used to clean substrates, but experience has been that it generally yields relatively poor results compared to sonic bath based cleaning and is slow compared to cleaning a batch of substrates at a time. It also often results in the use of large amounts of solvent in the Spin Coater, which can be a problem if these steps are performed in an environment where solvent removal is required, such as laminar flow.

However, sometimes spin cleaning and washing steps can be very useful, for example HMDS and certain other surface modification treatments can benefit from spin washing. At the same time, spin-coating semi-orthogonal solvents can also be used to remove some additives.

For spin washes, researchers typically use dynamic dispensing of medium volumes of solvent (50 µl for a standard 20 x 15 mm substrate) and possibly several washes. Note that if the solvent is not removed first (typically by wiping excess solvent from the interior of the Spin Coater with a cleanroom tissue), this can generate large amounts of solvent vapor that can affect the drying kinetics of subsequent films.

Spin coating cleaning and specific cleaning steps with Figure 1

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