The difference between high-low Temperature Test Chamber and hot and cold shock Test Chamber

1. The difference between the product test requirements of the high-low Temperature Test Chamber and the thermal shock Test Chamber

1. The high-low Temperature Test Chamber is mainly aimed at the high-low temperature reliability test of industrial products. Test various performance indicators of parts and materials of related products such as electronics, automobiles and motorcycles, aerospace, ships and weapons, colleges and universities, scientific research units, etc.

2. The thermal shock Test Chamber is mainly used for rapid heating and cooling tests of test samples. It is mainly used for electrical and electronic products and their components, and can also be used for reliability testing of other materials during storage, transportation and use in environments with rapid temperature changes.

This test equipment is used to conduct environmental simulation tests on the physical and other related characteristics of the product in accordance with the requirements of national standards or user-defined requirements under the conditions of instantaneous changes in high temperature and low temperature. Predetermined requirements for product design, improvement, qualification and factory inspection.

2. The difference between the temperature technical indicators of the high-low Temperature Test Chamber and the thermal shock Test Chamber

1. The temperature of the high-low Temperature Test Chamber can only be adjusted. The temperature change rate is determined according to the heating and cooling rate of the Test Chamber. The heating rate is generally 1~3°C/min, and the cooling rate is generally 0.7~1°C/min. The temperature conversion takes a relatively long time.

2. The thermal shock Test Chamber is reflected in the temperature change efficiency, which can realize rapid temperature change within 10 seconds to 15 seconds. Recovery time is 5 minutes. The thermal shock Test Chamber can realize the continuous temperature shock cycle process from high temperature to low temperature and then to high temperature in a very short time.

3. The difference between the production process of the high-low Temperature Test Chamber and the thermal shock Test Chamber

1. There is only one working room in the high-low Temperature Test Chamber. Put the sample into the working room and test the sample through temperature changes.

2. The difference between the high-low Temperature Test Chamber and the thermal shock Test Chamber lies in the word "shock". The impact Test Chamber can be divided into two compartments and three compartments according to the state of the sample during the test.

The hatchback type includes a high temperature room (heat storage room) and a low temperature room (refrigerated room). During the test, the sample is switched between the high-temperature chamber and the low-temperature chamber according to the temperature requirements to make the sample move.

The three-room type includes a high-temperature room, a low-temperature room and a laboratory for placing samples. During the experiment, the sample is stationary in the laboratory. According to the requirements of temperature changes, the high temperature room, the low temperature room and the working room are cycled. Channels circulate heat and cold to the lab, causing drastic changes in temperature.

4. The difference between the production cost of the high-low Temperature Test Chamber and the thermal shock Test Chamber

Due to different working methods, different temperature technical indicators, and different production costs, the price difference between the two is also very large.