The thermal shock Test Chamber is mainly used for temperature shock test.
It can be tolerated instantaneously in the continuous environment of extremely high temperature and extremely low temperature. It can switch from a high temperature of 150°C to a low temperature of -65°C within 10s-15s, and the recovery time can be completed within 5 minutes.

The high-low temperature impact Test Chamber is high temperature and low temperature test equipment, but because it takes a long time to complete the switch from high temperature 150°C to low temperature -65°C, it cannot meet the test requirements from high temperature to low temperature in a short time. Apparently, the test conditions were achieved by gradual cooling. For example, we need to complete the high temperature from room temperature to 150°C within 35 minutes, but after the high temperature test, we need to reach the ambient condition of -65°C within 3 minutes.

The functional difference between the hot and cold shock Test Chamber (high-low temperature shock Test Chamber) and the high-low temperature shock Test Chamber lies in the temperature change rate of the two. Structural conversion times are slightly different. The conversion time of the Three-Chamber thermal shock Test Chamber is less than 3s, and the conversion time of the double-box thermal shock Test Chamber is less than 5s, but no matter what kind of structure, the recovery time should be less than or equal to 5min. The high-low Temperature Test Chamber is an experiment that can simulate high temperature constant temperature conditions, low temperature constant temperature conditions and high-low temperature conditions.
The structural difference between the thermal shock Test Chamber and the high-low Temperature Test Chamber is that the thermal shock Test Chamber is generally a Three-Chamber or double-box structure, while the structure of the high-low temperature test box is a single box.