FlexTest-F-C Flexible Test System, Folding Clamp

FlexTest-F-C

Folding jig

Introduction

The emergence of flexible electronics has provided a new direction for the development of classical electronics and triggered the emergence of new forms of electronic devices. However, in the process of transforming electronic materials and devices from rigid to flexible, the traditional rigid test methods have become unable to fully adapt, and the matching flexible test system has become necessary to promote the development of the flexible electronics industry.

In the testing process of flexible electronic materials and devices, especially in the initial stage of development and verification of flexible electronic materials and devices, it is of great significance to develop a modular flexible materials and devices test system with high degrees of freedom to improve the efficiency of development and verification and reduce the test cost.

Product Features

Test zero stress

No surface friction

The bend radius is as low as 0.5mm

High reliability (million cycles)

Scalability (multi-station, optical, electrical performance testing assistance systems)

Scope of application

Folding testing of flexible materials and devices such as thin films, coatings, OLEDs, solar cells, RFID, FPCs, sensors, wearable electronics, etc.

Operating Principle

Product dimensions

Packing list：Fixture X1, manual X1, certificate of conformity X1, warranty card X1

[Note]Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.