
SC series gluing machine (Hot Plate) is suitable for semiconductor silicon wafers, glass slides, wafers, substrates, ITO conductive glass and other processes. After the surface of the plate is coated, the film is dried and cured. The Hot Plate has high temperature stability and good repeatability. Used for production, scientific research and teaching in industrial and mining enterprises, scientific research, education and other units.
1. The stability performance is very good, and the temperature stability can reach ±0.5°C.
2. Wide temperature adjustment range: room temperature -500°C .
2. Closed-loop control is adopted, and the heating speed is fast.
3. It has timing function. At the same time with a countdown display function. (II, II types have)
4. The temperature and time are controlled by digital buttons, and the temperature and time settings are more accurate.
5. The body is all made of stainless steel, acid and alkali resistant and corrosion resistant.
6. According to the size of the customer's substrate, provide customized Heating Plate service.