China Perovskite Experimental Film Applicator TBJ-X3-ABO with imported bar with air knife + air knife bracket

QLab ITO Glass coated with powder + polymer material, which is suitable

QI apply perovskite film, the thickness requires a few hundred nanometers, and the maximum size is 20 cm.

QSlurry, perovskite solvent Air knife

QMake perovskite The width should be 300mm.

QWe make perovskites with adjustable speed and fixed speed. Substrate: sapphire substrate Film thickness: the thinner the better Vacuum adsorption + heating Some perovskites need to reach 250 degrees Air knife

Qserial number, equipment name, technical index, quantity 1. Substrate: FTO Glass /ITO Glass/flexible conductive film (attached to rigid substrate) suede silicon wafer and other planar substrates treated with ultraviolet ozone. 2, with vacuum adsorption system 3. The size of the sample stage is not less than 200 x 300 mm 4. Electrical safety design: electrical cabinets with wire number tubes, cold-pressed terminals and other signs and attached crimping parts to avoid short circuits ★ 5. There is an alarm recording function and page in the HMI. After an alarm occurs, you can view the alarm information recorded on the alarm recording page 6. Visualization of system parameters, direct display of platform position, cutter head height, slot-die thickness, Spreader speed, injection speed, injection volume and other parameters, with formula storage function to achieve good process Repeatability 7, coating wet film thickness 10-200µm 8, coating dry-film thickness 0.2-10 µm 9. Cutter head height: 20-1000um 10. Spreader waiting time: 0-30 seconds 11. Solid content: 10-50% 12. Viscosity: 1-2000cps 13. Spreader speed: 0-100 mm/s 14. Outlet speed: 0.1-40 ml/min 15, automatic mode extraction amount: 0.1-10 ml ★ 16. Equipped with a professional air knife 17. The reservoir capacity is not less than 10 milliliters 18. The total travel of the cutter head is 0-50 mm 19, die and platform distance: fine adjustment adjustable range: 0-10 mm, unit adjustment accuracy: no more than 0.005 mm, coarse adjustment range: 0-50 mm 20. The level of the desktop placed on the base: no more than 0.1 mm 21. Y-axis operation is not less than 0.01 mm for the full scale of the sample stage ★ 22, Z-axis Repeatability: ≤ 0.006 mm ★ 23, the cutter head level ：≤ +/- 3um 24, cutter head slot-die width to provide at least three specifications adjustable: 0-0.05/0-0.08/0-0.1 mm 25. Equipped with tool setting instrument, with automatic tool setting and tool head deviation compensation function 26. The effective width of the cutter head is not less than 100 mm 27. The whole machine adopts marble load-bearing shock-absorbing substrate platform 28. Adopt two levels to adjust the platform level 29. The working surface finish is not less than Rz 0.3 30. With suede silicon wafer Spreader platform automatic lifting function 31. Equipped with a waste liquid recovery device. 32. Dynamic range pulse cooperative modulation setting adjustment with system status feedback 33. The Spreader platform has a separate leveling mechanism 34. The platform has a sample positioning function 35. Process holographic capture mode monitoring and control to achieve control and display of each subsystem 36. Fully enclosed low-resistance permanent magnet linear servo motor 37. The Z axis adopts encoder and grating ruler double closed-loop feedback 38. Return to the origin crawling speed Z axis: 0.001-1 mm/sec 39. Return to the origin crawling speed Y axis: 0.002-5 mm/sec 40, in-situ heating function, with substrate heating function 41, the maximum heating temperature 100 degrees Celsius 42,7-Inch high definition touch screen operation, no computer required 43. Adopt PLC programmable controller with built-in positioning: independent 4-axis 200kHz pulse output 44. Built-in analog input and output: A/D 2 channel 12-bit, D/A 1 channel 12-bit 45, with control scale: 32~ 256 points (CPU unit: 32/64/80 points) CC-Link, AnyWireASLINK and Bitty including remote I/O maximum 512 points 46. Built-in high-speed counter: maximum 8ch 200kHz high-speed pulse input 47. With safety warning prompt function, error prompts are given through the screen display 48. With formula storage function, it can save more than 8 sets of mature process parameters to achieve good process Repeatability 49, Spreader cutter head through special surface heat treatment, anti-organic solvent, anti-deformation. ★ 50. Equipped with automatic Safety protection function, using the feedback and hard limit of multiple Sensors equipped with itself to automatically identify the danger zone to ensure that the Spreader mold is safe and does not collide with the knife under working conditions 51. With different suede silicon wafer thickness error self-correction function 52, with suede silicon substrate Spreader leakage adsorption function Main configuration list: 1. 1 set of Spreader host: including laser knife instrument, vacuum adsorption, sample stage, a knife head, and a set of liquid injection system; 2. 1 set of in situ heating; 3. 1 set of air knives; 4. 1 set of suede silicon wafer tooling. 1 set 5 Automatic Scraper instrument ★ Scraper width: ≥ 150mm Substrate thickness: 1-3 mm ★ heating temperature: up to 150 degrees Celsius Size of heating plate not less than 400 * 250 mm Solution viscosity: 0.8-10000cps Coating applicator accuracy 5μm Spreader speed 1-100mm/s (stepless variable) Stable speed Film thickness: 5-3000 µm (wet-film) Uniform temperature: +/- 2 degrees Celsius Movement speed: 0-100 mm/s Coating applicator: need to configure not less than 150mm and 100mm coating applicator Control Unit: Touch Screen Sample stage: vacuum adsorption plate not less than 250 * 150 mm (effective Spreader size) Main configuration list: 1. 2 sets of coating applicators 2. 2 sets of relays 3, adsorption heating platform 1 set 4. 1 set of PLC control 5. 1 set of touch screen 6. Stepping drive 1 set 7, heating indicator 1 set 8. 1 set of air inserts 9. A diaphragm vacuum pump 10. 1 set of air knives 6 Hot press packaging machine ★ Maximum package size: 400 * 400mm Operating temperature: 70-160 degrees Celsius ★ Working area Temperature uniformity ≤ +/- 2 degrees Celsius Table Smoothness ≤ 300μm/m2 Curing time 6-8 minutes (adjustable) Hot pressing time 2-4 minutes (adjustable) Control system: PLC control, display screen operation, segmented program control vacuum heating and pressure Main equipment configuration: 1. 1 set of PLC controller 2. 1 set of vacuum pressure switch controller 3. 1 set of silent vacuum pump 4. 1 set of touch screen 5. 1 set of control appliances 6, can automatically record the number of lamination, Chinese Operating interface Control system 1 set

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