Specifications
| Heating method | The temperature is directly controlled by the chip holder itself, and the heat exchange speed between the silicon wafer and the chip holder is about 1-3 seconds |
| rotational speed | 100-3000rpm, acceleration 100-3000 rpm, 5 speeds, 12 sets of parameter memory |
| Temperature control mode | Temperature control, the suction cup is directly and quickly raised to the process temperature |
| Heating time control | 1-9999 seconds or 1-9999 minutes |
| Heating part | Film holder, suction cup, temperature control heating |
| heating temperature | Room temperature~ RT + 150 ℃ |
| Rotational torque | 100Rpm torque greater than 1N.m speed stability |
| Suction cup | Customized, suitable for item size No. 5-100. |
| Voltage | 220V |
| power | 600W |
| Host Dimensions | Length 400mm × Width 250mm × Height 350mm |
Packing list
host X1, manual X1, certificate X1, warranty card X1
After-sales instructions
Warranty days: 365 days
1.仪器设备非人为造成的产品质量问题，在质保期内厂家提供免费质保服务；
2.易损易耗配件不存在质保期，收到货发现产品质量问题，请在7天内申请退换货，逾期不候；
[Note] For after-sales services outside the Chinese mainland, if the instrument requires repair, the shipping and possible associated taxes shall be borne by the sender. Generation address of the manual: http://en.nbchao.com/p/49293/Specification.html , which is only used by users who purchase commodities from the NBCHAO.