NBC-XF200S Plate slot die coater slot-die Extrusion Automatic Film Applicator
NBC-XF200S
Factory NBC-XF200S Plate slot die coaterSPEC
Factory NBC-XF200S Plate slot die coaterDetails
Factory NBC-XF200S Plate slot die coaterPacking list
- SKU
- NB050303
- Spreader size
- Adjustable (according to slot-die die specifications)
- substrate size
- Max 220x240mm Flatness: +/- 3μm; Maximum substrate heating temperature: 150 ℃
- Mechanical speed
- Traverse speed 0-200mm/s (parameter can be set)
- Film thickness
- 0.02-10 mm for flexible and rigid glass substrates
- Substrate clamping method
- Vacuum chuck
- Spreader platform material
- Marble base + high Accuracy stainless steel adsorption platform
- Feeding system
- High Accuracy liquid supply pump + corrosion resistant pipeline + luer joint
- Feeding speed
- 0-10Ml/min14; supply Accuracy: 0.05ml/s0.05-5mm/s; advance supply time: 0-10s
- Spreader uniformity
- Film thickness uniformity ≤ 3% -5% (depending on Spreader process, inks, substrate)
- Applicable viscosity
- 1-3000Cps (various oily/water-based UV adhesives, inks and other solvents)
- Air knife
- Equipped with aluminum alloy nitrogen air knife
- Installation size
- L740mm*W444mm*H425mm
- control mode
- AC servo + gear reducer + screw + grating feedback + PLC automatic/touch screen control
- Coating method
- extrusion coating
- Lip height
- 0~5Mm, adjustable
- Adjustment Accuracy
- A. Digital dial: 1um
- Coating Accuracy
- +/- 2μm (reference value depends on slurry characteristics)
- Die head model
- TG-C200
- Die head material
- SUS630
- Die Accuracy
- Lip straightness ≤ 3μm
- cavity Volume
- 8ml
- gasket width
- Opening width Max. 200mm
- Film thickness
- 30/50/70/100/200um (Film thickness is selected according to solution viscosity)
- Weight
- About 120Kg
- Power Supply
- 380V/50HZ, power 5KW
Product Introduction
TG flat slit coating machine is a equipment applied to the surface coating of sheet substrate, using slit die coating process, mainly used in laboratory research and development, can work in the glove box. This equipment is mainly used for the surface coating of chip substrates in the fields of various types of glue, lithium battery substrates, OLED, solar photovoltaic films and polymer conductive films.
Functional features:
1. High coating accuracy and good consistency.
2. The coating window is wide, and the viscosity is more applicable.
3. The coated substrate is a vacuum suction plate, and the substrate can be evenly adsorbed on the surface of the coated plate.
4. The device can be used in an argon atmosphere inside the glove box.
5. Touch screen operation, convenient and fast equipment parameter adjustment, storage and control.
Process introduction
Brief description of the process: After the coating enters the coating die, it flows out at the outlet through pressure distribution and is coated on the surface of the substrate to form the target coating. The coating thickness and size are affected by the feeding speed and coating speed, and the coating accuracy is affected by many factors such as die accuracy, die adjustment accuracy, flatness of the coating plate, movement speed accuracy, feeding accuracy and coating characteristics.