This standard specifies requirements, test methods, inspection rules, marking, Encasement, transportation and storage of aluminum oxide ceramic substrates for thick film integrated circuits. It is suitable for the production and procurement of aluminum oxide ceramic substrates for chip components using thick film processes to ensure that their geometry and physical performance meet the needs of manufacturing and application.
| Status | Active |
|---|---|
| CCS | L90 | ICS | 31.030 |
| Release Date | 2013-11-12 00:00:00 | Implementation Date | 2014-04-15 00:00:00 |