SJ/T 11779-2021 "Thermally conductive coated Resin copper foil for printed circuits" is a standard for the technical requirements and detection methods of thermally conductive coated Resin copper foil products in the printed circuit board industry. The standard specifies the classification, requirements, test methods, inspection rules and signs, Encasement, transportation, storage, etc. of coated Resin copper foil. The standard aims to guide production enterprises to formulate production processes, ensure product mass stability and reliability, meet the requirements of electronic products on thermal conductivity, promote industry technological progress and product mass improvement, and provide reliable technical basis and mass guarantee for the market.
| Status | Active |
|---|---|
| CCS | (L30) 印制电路 | ICS | (31.180) 印制电路和印制电路板 |
| Release Date | 2021-03-05 00:00:00 | Implementation Date | 2021-06-01 00:00:00 |