SJ/T 10454-2020 "Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits"

This standard specifies the technical requirements, test methods, inspection rules, Encasement, storage and transportation of dielectric slurry for multilayer wiring of thick film hybrid integrated circuits. It is applicable to the dielectric slurry for multilayer wiring of thick film hybrid integrated circuits matched with gold and palladium silver conductor slurry. Among them, the terms and definitions specify that the dielectric slurry is a paste composed of oxide powder, organic carrier and additive, which is suitable for screen printing or coating. The technical requirements specify that the properties of the slurry shall comply with the provisions of Table 1.

This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.