The GB/T 16998-1997 standard specifies the method for determining the thermal stability of hot-melt adhesives. The purpose of this standard is to evaluate the Stability and heat resistance of hot-melt adhesives under high temperature conditions. Through the specified test procedures, the heat resistance of hot-melt adhesives during use can be tested to ensure that their performance in high temperature environments is stable and meets practical application requirements.
| Status | Active |
|---|---|
| CCS | G38 | ICS | 83.180 |
| Release Date | 1997-09-26 00:00:00 | Implementation Date | 1998-04-01 00:00:00 |