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GB/T 40279-2021 《Test method for thickness of films on silicon wafer surface—Optical reflection method》 Related products

The standard "GB/T 40279-2021 Optical inspection reflection method for testing film thickness on the surface of silicon wafers" specifies the method for measuring the film thickness of silicon dioxide film and polysilicon film on the surface of silicon wafers using Optical inspection reflection method. It is suitable for testing smooth, transparent or translucent films with film thickness ranging from 15 nm to 105 nm, such as amorphous silicon, silicon nitride and photoresist, etc. The standard describes in detail the interaction of the incident ray with the film interface, including reflection, refraction and interference principles. By analyzing the wavelength of light and the optical path difference of the film, it is possible to accurately measure the film thickness of the film. Optical inspection is particularly suitable for films with stable characteristics and low absorption coefficient.

This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
Status Active
CCS H21
ICS 77.040
Release Date 2021-08-20 00:00:00
Implementation Date 2022-03-01 00:00:00
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