The standard "GB/T 29507-2013 Wafer Flatness, Film thickness and total Film thickness change test, automatic non-contact scanning method" stipulates an automatic non-contact scanning method for testing wafer flatness, Film thickness and total Film thickness change. This method is suitable for silicon wafers with a diameter of not less than 50 mm and a Film thickness of not less than 100 μm, including cutting, grinding, etching, polishing and epitaxy. This standard provides an efficient non-Destructiveness test technique for accurate measurement of the flatness and film thickness changes of silicon wafers without affecting them, regardless of changes in film thickness, surface state, and shape.
| Status | Active |
|---|---|
| CCS | H80 | ICS | 29.045 |
| Release Date | 2013-05-09 00:00:00 | Implementation Date | 2014-02-01 00:00:00 |