This standard specifies the test method and data processing requirements for the tensile performance of ribbon films, which are suitable for samples with film thickness between 50 nm and several microns and the ratio of length to Film thickness greater than 300. The standard is particularly suitable for mass monitoring of ribbon film structures of microelectromechanical systems (MEMS) products. By standardizing the test method, key performance indicators such as resilience modulus and yield strength of the films can be accurately determined, providing a reliable test basis for the development and production of MEMS technology.
| Status | Active |
|---|---|
| CCS | L55 | ICS | 31.200 |
| Release Date | 2020-03-06 00:00:00 | Implementation Date | 2020-10-01 00:00:00 |