GB/T 13555-1992 "Flexible Copper Clad Polyimide Film for Printed Circuits" specifies the technical standards for such films. The standard specifies product classification and specifications, specifies key indicators such as Appearance mass, dimensional accuracy, copper foil adhesion, electrical performance, and details test methods and inspection rules. At the same time, it makes requirements for product labeling, Encasement, transportation and storage. It provides a unified technical basis for mass control, performance testing and application of flexible copper clad polyimide film for printed circuits.
| Status | Abolish |
|---|---|
| CCS | L30 | ICS | 31.180 |
| Release Date | 1992-07-08 00:00:00 | Implementation Date | 1993-04-01 00:00:00 |