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GB/T 4909.12-2009 《Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method》 Related products

This standard specifies the test method for the weldability of bare wire platings by solder ball method, and describes the test equipment, sample preparation, measurement procedures and evaluation standards in detail. It is suitable for testing the wetting characteristics of tinned copper wires in molten solder, and provides key time indicators to evaluate the weldability of platings. This standard is of great significance to ensure the welding mass and reliability of wires and cables, and should be used in combination with GB/T 4909.1-2009.

This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
Status Active
CCS K11
ICS 29.060.10
Release Date 2009-03-19 00:00:00
Implementation Date 2009-12-01 00:00:00
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