This standard specifies a method for determining the resolution of precious metal slurry for microelectronics. The slurry forms a pattern on the substrate by screen printing. After sintering or curing, the line width and line spacing of the pattern are measured by a microscope at a certain magnification to evaluate the resolution of the slurry. This standard is applicable to determine the minimum line width and line spacing of precious metal slurry achievable in microelectronic devices to ensure that its performance meets technical requirements.
| Status | Active |
|---|---|
| CCS | H68 | ICS | 77.120.99 |
| Release Date | 2008-03-31 00:00:00 | Implementation Date | 2008-09-01 00:00:00 |