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What is the principle of thermal imaging detection of defects?

Abstract: 这篇文章阐述了热成像检测缺陷的原理。热成像技术通过远程测量表面温度分布来检测亚表面缺陷,如由于涂层和基材粘合质量降低导致的脱粘区域。缺陷会阻碍热流通过基板-薄膜系统,从而在表面产生温度变化,红外传感器可以捕捉到这些温度差异,形成缺陷的“图像”。这种方法能够准确地显示缺陷的实际形状,特别是当缺陷与表面之间的距离较小时,其表面“图像”与真实缺陷的对应性较好。根据经验,缺陷的线性尺寸应至少是从界面到表面距离的两倍,以确保表面上能够明显再现缺陷。

The main advantage of thermal imaging methods is that they generate long-range maps of surface temperature distribution, whatever the cause. This principle has been successfully applied to detect subsurface defects that may occur due to any deterioration in the bonding quality of coatings and substrates.

Detection of disbonded area maps by resistance to heat flow through a substrate-thin film system

Detection of disbonded areas by resistance to heat flow through the substrate-thin film system

As shown, if there are obstacles such as defects or peeled areas blocking the surface of the specimen, the heat flux from the inside of the specimen towards the surface can make a more or less significant difference in the uniform temperature of the surface. The shape of the temperature drop area is visible on the surface by an infrared sensor. This is a fairly accurate replica of the real defect, which would otherwise be invisible. As the distance between the defect location and the surface decreases, the agreement between the true shape of the disbonded area and its "image" on the surface becomes better. Optically, this situation is similar to shadows formed from distant objects.

As a rule of thumb, the linear dimension of the disbonded area should be at least twice the distance from the interface to the surface. Under these conditions, apparent defect reproduction on the surface can be expected.

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