China

YINUO YN-226 Microcomputer Interlayer bonding strength Tester

YINUO YN-226 microcomputer Interlayer bond strength Tester is used to detect the bond strength between paper and Cardboard layers (between paper layers and layers, within paper), YN-226 microcomputer interlayer bond strength measurement sampling size and quantity 25.4mm × 128mm; 5 groups of samples, sample size range 25.4mm × 25.4mm, maximum sampling thickness 1.2mm.
Model:

YiNuo YN-226 Interlaminar Peel TesterSPEC

YiNuo YN-226 Interlaminar Peel TesterDetails

YiNuo YN-226 Interlaminar Peel TesterPacking list

SKU
NB033134
Specimen size
25.4*128mm
Specimen size
25.4*25.4mm
Maximum sampling thickness
1.2mm
Common sample pressure
(690±21)kpa (1034±34)kpa
Sample holding force
0~400N (adjustable)
Sample pressure range
0~65kg/cm²(0~950psi)
Primary pressure area
12.72cm²
Parallel positioning of specimen holder
R=0.4×10
Pressure arm ratio
231.08:0.8
release method
Fully automatic release
Impact Angle
90°
Resolution
0.001Lbf/in ², 5000 pulse high-precision encoder
Double-sided adhesive force
>486N/m
Measurement range
A档:(0~500)J/m²;B档:(500~1000)J/m²;C档:(1000~1500)J/m²
Self-calibrating
Dedicated 5-level calibrated tool set (additional)
Error of indication
A档:±1J/m²;B档:±2J/m²
unit
J/M²、lbf/in²
Display
3.2In LCD display, real-time display of test data
software
Optional computer connection software, office document processing documents, end point A4 printing
printout
modular integrated thermal printer
Dimensions
500*400*650mm
Weight
70KG
number of samples
Group of 5
YN-226
Interlaminar Peel Tester
YINUO YN-226 Microcomputer Interlayer bonding strength Tester Picture

use

YN-226 microcomputer interlayer adhesion strength Tester (interlayer peel strength Tester) is used to detect the interlayer adhesion strength of paper and cardboard (paper layer and layer, paper intralayer bonding), which can be used to detect the internal adhesion strength of sheet materials such as paper composite materials, film composites, etc.

The instrument adopts the Scott type internal bond strength testing method, and its detection principle is as follows: the combination of double-sided tape-specimen-double-sided tape forms a sandwich structure, which is pressed between a metal flat anvil and an aluminum block. The pendulum is struck against the inner surface of the upper part of the aluminum block to flip the aluminum block and destroy the specimen in the Z direction. The energy absorbed during the destruction of the specimen is calculated by determining the highest position of the swing, expressed in J/m2.

Enforce the standard

GB/T 26203、ASTM T569 pm-00

Scope of application

Basic applicationBobbin paperDetermination of interlayer peeling of paper tube paper, bobbin paper, kraft paper, etc
Gray cardboardAll kinds of gray cardboard, cardboard, composite cardboard, etc
Extend your applicationCattle cardKraft cardboard
White cardWhite cards, whiteboard paper, etc
wrapColor box
cigarette casecigarette case
Other materialsCigarette paper, wood, etc


FAQ
QIs the price listed on the website the final cost for overseas purchases?
ANo, it isn't. This is the ex-factory price of the product in the Chinese Mainland. In addition to this price, buyers from different countries need to account for additional costs such as shipping fees, tariffs, and others. For specific regional quotes, please consult our customer service or fill out a quotation form.
QWhat is the specific process for purchasing the product?
AFirst, please click on the quotation form on the website and fill in detailed information. Our customer service personnel will then send you a quotation based on your specific country and region, confirming payment and delivery methods. Following this, we proceed with contract signing, payment, and shipment. You can then await delivery.
QWhat should I do if the instrument I purchase needs repair?
AAfter-sales repair for overseas instruments is an unavoidable issue. Our repair terms stipulate that the sender is responsible for the shipping and insurance costs incurred for the repair. Repairs within the warranty period are free, while repair costs beyond the warranty period are determined based on the actual situation.