JINGWEN JW-110C interlayer disbonding Tester, Interlayer Bonding Strength Tester

JW-110C

Interlaminar Peel Tester

Compliant with GB/T 26203 and TAPPI T-569 standards, using electro-hydraulic pressure, high test accuracy (+/- 1 J/m ²), touch screen display, support RS232/USB communication output, and equipped with high-speed silent thermal printer

Introduction:

JW-110C Paper and Cardboard Internal Bonding Strength Tester is mainly used to test the Z-direction tensile strength of paper and cardboard (that is, interlayer bonding strength). It reflects the ability of paper and cardboard to resist interlayer separation, that is, the internal bond strength of paper and cardboard.

The internal bond strength can be fully controlled, which is very important for processing multi-layer paper and cardboard, if the internal bond value is low or uneven, it may cause paper and cardboard to appear when laying flat in offset printing presses using viscous inks. Problem; If the bonding strength value is too high, it will bring difficulty to processing and increase the cost of the company. This test is widely used in the printing and packaging industries of multi-layer cardboard such as boxboard, white cardboard, gray cardboard, and white cardboard.

Standards:

GB/T 26203 "Determination of Bonding Strength in Paper and Board (Scott)"

TAPPI T-569 "internal bond strength (scott type) correction"

Packing list：Host X1, power cord X1, manual X1

[Note]Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.