China and domestic (CN) NBC-150B Thermal Shock Test Chamber 18KW/150L

NBC-150B

Thermal Shock Test Chamber

Test Chamber Temperature Impact Range High Temperature Box: + 50 ° C~ 180 ° C; Low Temperature Box: 0 ° C~ -55 ° C, Temperature Fluctuation +/- 2 ° C;, Temperature Error +/- 2 ° C;, Heating Rate from Room Temperature~ 180 ° C ≤ 30min;, Cooling Rate from Room Temperature~ -55 ° C ≤ 60min.

The NBC-150B Thermal Shock Test Chamber is mainly used to test the resistance of materials to extremely high or low temperatures, which is similar to the situation of discontinuous high or low temperatures, and the thermal shock test can make various items complete the test in the shortest time. The changes or physical injuries caused by thermal shocks are caused by changes in thermal expansion and contraction or other physical values, and all kinds of products can be fully trusted by using the PID system. The effects of thermal shock include electrochemical changes caused by cracking or breaking layers and displacement of the finished product, and the full digital automatic control of the PID system will make it easy for you to operate.

The thermal shock testing machine is a necessary testing equipment for metal, plastic, rubber, electronics and other materials industries, which is used to test the material structure or composite materials, which can withstand the degree of continuous environment of extremely high temperature and extremely low temperature in an instant, so as to detect the chemical changes or physical injuries caused by thermal expansion and contraction of the test sample in the shortest time. It is divided into two-box and Three-Chamber, the difference is that the test method and internal structure are different, and the product meets the requirements of the standard for: GB/T2423.1-2008 test A, GB/T2423.2-2008 test B, GB-T10592-2008, GJB150.3-198, GJB360A-96 method 107 temperature shock test.

Application

Thermal shock Test Chambers are widely used in electronic and electrical components, automation parts, communication components, auto parts, metals, chemical materials, plastics and other industries, national defense industry, aerospace, military industry, BGA,PCBBase wrench, electronic chipIC, the physical changes of semiconductor ceramics and polymer materials, testing the repeated tensile force of the materials to high-low temperatures and the chemical changes or physical damage of the products in thermal expansion and contraction, can confirm the quality of the products, from precision ICs to heavy mechanical components, can be used as the basis or reference for product improvement.

Meets standards

• GB-2423.1-89 (IEC68-2-1) Test A: Low temperature test method

• GB-2423.2-89 (IEC68-2-2) Test B: High temperature test method

• GJB360.8-87 (MIL-STD-202F) High Temperature Life Test

• GBJ150.3 (MIL-STD-810D) High Temperature Test Method

• GJB150.4 (MIL-STD-810D) Low Temperature Test Method

• National military standard GJB150.3-86

• National military standard GJB150.4-86

• National military standard GJB150.5-86

Packing list：host X1, manual X1, certificate X1, warranty card X1

[Note]Because the manufacturer's packaging may be updated or upgraded, the detailed packaging list shall be subject to the latest standard configuration of the manufacturer.